RIR Power to start business manufacturing of semiconductor chip subsequent March, says Odishas Principal Secretary for IT

RIR Power Electronics Ltd. is anticipated to start “full-fledged” business manufacturing of digital chips by March subsequent 12 months, Principal Secretary within the Electronics and Information Technology Department of the Government of Odisha Vishal Dev informed The Hindu.

In an interplay on the sidelines of the Semicon India 2025, Mr. Dev acknowledged that the opposite two tasks, that of SiCSem and 3D Glass Solutions (3DGS), are anticipated to start out manufacturing in one other two years.

Commencement of economic manufacturing on the semiconductor maker’s Bhubaneswar plant is of immense significance to the eastern-Indian state, he mentioned.

RIR Power on September 1, 2025, obtained ₹32.56 crore in fiscal help for Phase 1 of their silicon carbide manufacturing plant within the state’s capital. Spanning throughout two phases, the challenge is value about ₹618 crore.

About the opposite tasks, the Union Cabinet on August 12 had permitted manufacturing items in 4 states, together with Odisha, with a mixed outlay of ₹4,600 crore. SiCSem and 3D Glass are to be arrange within the coastal jap Indian state. The former is collaborating with Clas-SiC Wafer Fab Ltd. (U.Okay.) to construct the primary business compound fab within the nation, while the latter can be organising a vertically built-in superior packaging and embedded glass substrate unit – each in Info Valley, Bhubaneswar.

Leveraging inherent benefits

Mr. Dev, mentioning Odisha’s benefits in offering important utilities, pointed to Odisha being an influence surplus state and having sufficient water availability. “We have 11% of the nation’s water assets whereas we’re 3% of the nation’s general inhabitants,” he acknowledged, including, “We even have the most affordable energy within the nation.”

The Principal Secretary additional held that the state has a semiconductor coverage which is “by far the perfect coverage when it comes to comprehensiveness and quantum of incentives”.

Odisha’s Electronics Component Manufacturing (OECM) Policy, 2025, provisions for a 30% capital funding subsidy with no ceiling. Furthermore, the primary 5 meeting, testing, marking and packaging (ATMP) tasks together with the primary three fabs would additionally 50% subsidy. Neither of them holds any cap. Mr. Dev additionally underlined that skilling is recognised as a excessive precedence sector within the realm.